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luxeon flip chip ds116 ?2013 philips lumileds lighting company. features ? high drive current up to 1 a/mm 2 ? 1 .0 mm x 1 .0 mm 5-sided emitter ? 440-460 nm wave length ? low typical forward voltage of 2.9v ? low thermal resistance ? symmetric, large bond pads bumped with ausn solder key applications ? high-power led emitters ? chip on board applications ? remote phosphor applications benefts ? high current density for high lumen and lm/$ at high lm/w ? high-packaging density ? 5-sided emitter for dispense and remote phosphor applications ? surface mount capable ? no wire bonds ? robust design with proven lumileds reliability luxeon flip chip chip scale package led introduction philips lumileds luxeon ? flip chip led technology enables the next generation of lighting applications. customers now have complete design fexibility to access lumileds industry leading performance at the die level and customize the phosphor and packaging to best suit their lighting applications. luxeon flip chip is a real chip scale package led that can be attached by refow without additional packaging. traditional wire bonding limits the packing and power density of leds. luxeon flip chip leds can be packaged closer and can be driven at a higher current density, therefore requiring fewer emitters to achieve a higher lumen output at higher lumen densities. this document contains the performance data needed to design and engineer philips lumileds luxeon flip chip based application.
luxeon flip chip ds116 20131105 ?2013 philips lumileds lighting company. i table of contents product nomenclature 2 environmental compliance 2 absolute maximum ratings 4 mechanical dimensions 4 characteristic curves 5 relative spectral power distribution vs wavelength 5 forward current vs forward voltage 5 typical relative radiometric power vs forward current 6 peak wavelength shift vs forward current 6 relative radiometric power vs junction temperature 7 peak wavelength shift vs junction temperature 7 typical translation from peak wavelength to dominant wavelength 8 radiation patterns 9 bin structure for luxeon flip chip 10
luxeon flip chip ds116 20131105 ?2013 philips lumileds lighting company. 2 product nomenclature the part number designation for luxeon flip chip follows: l h d f - r b 1 0 a b c d e f g h i where: rb C designates color (rb for royal blue) 10 C designates die dimension (10 for 1.0mm 2 ) a C designates peak wave length bin (values 3, 4, 5, 6 per description of bin codes) b C designates bond pad fnish (a for pad bumped with ausn solder) cd C open slot to accommodate additional product requirements efgh C minimum radiometric power performance (mw) i C additional product designator (default value = 1) environmental compliance philips lumileds is committed to providing environmentally friendly products to the solid-state lighting market. luxeon flip chip is compliant to the european union directives on the restriction of hazardous substances in electronic equipment, namely the rohs and reach directives. philips lumileds will not intentionally add the following restricted material to the luxeon flip chip: lead, mercury, cadmium, hexavalent chromium, polybrominated biphenyls (pbb) or polybrominated diphenyl ethers (pbde).
luxeon flip chip ds116 20131105 ?2013 philips lumileds lighting company. 3 product performance and characterization guide table 1. optical characteristics at t j = 25c, i f = 350 ma part number peak wavelength (nm) [1,2] typical spectra half-width (nm) typical temperature coeffcient of peak wavelength [3] (nm/c) min max lhdf-rb10300000000 440 445 24 0.05 lhdf-rb10400000000 445 450 lhdf-rb10500000000 450 455 lhdf-rb10600000000 455 460 notes for table 1: 1. philips lumileds maintains a tolerance of 2nm for peak wavelength measurements. 2. please see figure 8 for typical translation from peak wavelength to dominant wavelength. 3. measured between 25c and 85c at i f = 350 ma. table 2. performance characteristics at t j = 25c, i f = 350 ma part number min radiometric power (mw) [1,2] typical h/c factor [3] lhdf-rb10300005000 500 0.95 LHDF-RB10400005000 500 lhdf-rb10500005000 500 lhdf-rb10600004500 450 notes for table 2: 1. radiometric power values are based on a die packaged on ceramic tile with high refective surface and dome encapsulation. 2. philips lumileds maintains a tolerance of 6.5% on radiometric power measurements. 3. h/c factor is the radiometric power ratio between 25c and 85c at i f = 350 ma. table 3. electrical characteristics at t j = 25c, i f = 350 ma part number forward voltage (v) [1] typical temperature coeffcient of forward voltage [2] (mv/c) d v f / d t j min ty p max lhdf-rb10400000000 2.7 2.9 3.1 -2 to -3 notes for table 3: 1. philips lumileds maintains a tolerance of 0.06v on forward voltage measurements. 2. measured between 25c and 85c at i f = 350 ma.
luxeon flip chip ds116 20131105 ?2013 philips lumileds lighting company. 4 absolute maximum ratings table 4. operating condition and ratings parameter maximum performance dc forward current [1] [2] 1050 ma peak pulsed forward current [3] 1300 ma storage temperature -40c - 135c led junction temperature [1] 135c esd sensitivity [4] 200v (hbm, class 0b per js-001-2012) reverse voltage luxeon flip chip is not designed to be driven in reverse bias notes for table 4: 1. proper current de-rating must be observed to maintain the junction temperature below the specifed maximum junction temperature. 2. residual periodic variations due to power conversion from alternating current (ac) to direct current (dc), also called ripple, with frequencies 100hz and amplitude 250 ma are acceptable, assuming the average current throughout each cycle does not exceed the specifed maximum dc forward current and the junction temperature is kept below the specifed maximum junction temperature. 3. pulsed operation with a peak drive current of 1300 ma is acceptable if the pulse on-time is 5ms per cycle and the duty cycle is 50%. 4. please see the luxeon flip chip application brief for additional information on esd protection. mechanical dimensions figure 1. mechanical dimensions, luxeon flip chip lhdf-rb10 xxxx xxxx x. notes for figure 1: 1. drawing is not scale. 2. all dimensions are in micrometers . 3. a notch in the bond pad center indicates the anode. 4. the bond pads are bumped with ausn solder. 5. luxeon flip chip is qualifed for ausn refow attach on ceramic and mcpcb substrates.
luxeon flip chip ds116 20131105 ?2013 philips lumileds lighting company. 5 characteristic curves relative spectral power distribution vs wavelength figure 2. relative spectral power distribution at t j = 25c, i f = 350 ma. forward current vs forward voltage figure 3. forward current vs. forward voltage at t j = 25c.
luxeon flip chip ds116 20131105 ?2013 philips lumileds lighting company. 6 typical relative radiometric power vs forward current figure 4. typical relative radiometric power vs. forward current at t j = 25c. peak wavelength shift vs forward current figure 5. peak wavelength shift vs. forward current at t j = 25c.
luxeon flip chip ds116 20131105 ?2013 philips lumileds lighting company. 7 relative radiometric power vs junction temperature figure 6. relative radiometric power vs. junction temperature at i f = 350 ma. peak wavelength shift vs junction temperature figure 7. peak wavelength shift vs. junction temperature at i f = 350 ma.
luxeon flip chip ds116 20131105 ?2013 philips lumileds lighting company. 8 typical translation from peak wavelength to dominant wavelength figure 8. typical translation from peak wavelength to dominant wavelength at t j = 25c, i f = 350 ma.
luxeon flip chip ds116 20131105 ?2013 philips lumileds lighting company. 9 radiation patterns figure 9. typical spatial radiation pattern at t j = 25c, i f = 350 ma. figure 10. typical polar radiation pattern for luxeon flip chip. note for figures 9 and 10: radiation pattern is measured for the die packaged on ceramic tile with high refective surface and dome encapsulation.
luxeon flip chip ds116 20131105 ?2013 philips lumileds lighting company. 10 bin structure for luxeon flip chip luxeon flip chip is characterized at t j = 25c, i f = 350 ma and sorted on bin sheets. a specifc bin sheet only contains luxeon flip chip within a single bin for radiometric power, peak wavelength, and forward voltage. an order for a specifc part number at a given peak wavelength bin can be flled from any bin combination of radiometric fux and forward voltage. bin sheets are labeled by a four digit alphanumeric cat code abcd following the format below. table 5. a bc d radiometric power (mw) [1] peak wavelength (nm) [2] forward voltage (v) bin code min max bin code min max bin code min max e 450 500 3x 440 445 7 2.7 2.8 f 500 550 4x 445 450 8 2.8 2.9 g 550 600 5x 450 455 9 2.9 3.0 h 600 650 6x 455 460 0 3.0 3.1 notes for table 5: 1. radiometric power values are based on a die packaged on ceramic tile with high refective surface and dome encapsulation. the availability of fux bins will vary depending on peak wavelength. 2. limited availability for bin 3x and 6x.
ds116 20131105 ?2013 philips lumileds lighting company. all rights reserved. luxeon is a registered trademark of the philips lumileds lighting company in the united states and other countries. www philipslumileds com www philipslumileds cn com philips lumileds lighting company shall not be liable for any kind of loss of data or any other damages, direct, indirect or consequential, resulting from the use of the provided information and data. although philips lumileds lighting company has attempted to provide the most accurate information and data, the materials and services information and data are provided as is and philips lumileds lighting company neither warranties, nor guarantees the contents and correctness of the provided information and data. philips lumileds lighting company reserves the right to make changes without notice. you as user agree to this disclaimer and user agreement with the download or use of the provided materials, information and data. who we are philips lumileds focuses on one goal: creating the worlds highest performing leds. the company pioneered the use of solid-state lighting in breakthrough products such as the frst led backlit tv, the frst led fash in camera phones, and the frst led daytime running lights for cars. today we offer the most comprehensive portfolio of high quality leds and uncompromising service. philips lumileds brings leds qualities of energy effciency, digital control and long life to spotlights, downlights, high bay and low bay lighting, indoor area lighting, architectural and specialty lighting as well as retroft lamps. our products are engineered for optimal light quality and unprecedented effcacy at the lowest overall cost. by offering leds in chip, packaged and module form, we deliver supply chain fexibility to the inventors of next generation illumination. philips lumileds understands that solid state lighting is not just about energy effciency. it is about elegant design. reinventing form. engineering new materials. pioneering markets and simplifying the supply chain. its about a shared vision. learn more about our comprehensive portfolio of leds at www philipslumileds com . rohs compliant no. e352519

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